Boleh kita berkongsi pengalaman kerja? Ini pengalaman kerja saya sejak 7 tahun yang lepas (Sorry.. paste dr resume jer).. mana tau kita boleh berkongsi-kongsi maklumat yang berguna. 1. Company Name : 5th company Position Title : Senior R&D Engineer Work Description : - To lead project of Power QFN in cross-functional team. - To develop and characterize process development in wafer backgrinding, wafer sawing, epoxy die attach and aluminum wire bonding. - To ensure 4Ms readiness (man, machine, material and method) prior HVM (high volume manufacturing). - To prepare process specs, FMEA, control plan and machine buy-off documentation. - To perform various evaluation and DOE for process improvement. 2. Company Name : 4th company Position Title : Senior Process & Product Development Engineer Work Description : - To develop new products based on the market demands. - To intialize the design and process development for new products introduction (NPI) by preparing process flow, control plan and FMEA. - Prototyping for new products in short cycle time. - To utilize the knowledge in statistics and design of experiments for product development. -To liase with customer on the new product request and follow up in R&D stages. - To analyze and inteprete product failures with producing the containment and improvement plan. - Being responsible to develop and intialize the design and process development for new products introduction (NPI) such as SOT, SC70, VCSEL, RCLED and others. - Being Independent or with minimum supervision in coordinating projects in cross functional teams including FOL, EOL and test. -To run DOE for process and product evaluation. - Continously act as a key player in a front of line process especially die attach. 3. Company Name : 3rd company Position Title : Senior R&D Engineer Work Description : - In charge of Punch QFN, Saw QFN and BCC products of back grinding, sawing and die attach process. - As a key player in several new technology projects such as stacked die, GaAs die, wafer back coating, thin backgrinding and MSL improvement for Punch QFN. - To prepare a robust process readiness for the new packages in the production lines. - To aid the process engineering to solve any major issues in the production line. - Provides specs, DOEs, presentation, paper works for transfering the R&D mode packages to HVM (High Volume Manufacturing). - To run qualification lots, process characterization and engineering evaluations. -Develop software-based die attach set-up guideline and quality surveillance for quality optimization. -Having experience in handling multiple types of epoxy such as EN4900F, LMISR4, 8290, CB011, CRM1576C, QMI536, QMI550, QMI519, CRM1076E, RP-751-3D and others. - Very much hands on on the die bonder ESEC2008XP & HS. 4. Company Name : 2nd company Position Title : Process Engineer Duties: - Incharge of quality and productivity of SOT packages at die attach process in Front of Line (FOL) . - Incharge of vision system for die attach and outlining the vision system at 3rd optical inspection at front of line process. - Outlining die attach wafer mapping project. - Developing die attach set-up guideline software for SOT packages. - Incharge of screen printing (full cure & half cure) process at die attach process. - Very much hands on the ESEC 2008Xp, ESEC 2007HS and ESEC 2006HR. 5. Company Name : Kuala Lumpur Motorola (M) Sdn. Bhd. Position Title : Trainee Engineer Work Description : - Involved in Metal Finishing Department activities. -Meeting and discussed with supplier on the retrofitting of the machine. -Be familarized with the process and quality system. -Assist supervisor in term of project readiness and management. - Develop a 3D solid modeling of an actual autoplater equipment using AutoCAD R14 in plating process.